Description
.It is specially designed and used for mobile phone chips. The round and square precise hole positions make the solder balls more rounded and meet the tin planting requirements for various chips.
.Ultra-thin design, better fit of tin planting, continuous bending and full toughness
.High-quality special steel is selected, which has good high temperature resistance and metal fatigue resistance, so that each tin point is heated evenly
.Special chip half-cut + cut-through to meet different requirements
.Suitable for IP6G/6P/6S/6SP/7G/7P/8G/8P/X/XS/XS Max/XR/11/11 Pro/11 Pro Max/12/12 Mini/12 Pro/12 Pro Max/13/ 13 Mini/13 Pro/13 Pro Max/14/14 Plus/14 Pro/14 Pro Max